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InterWorks Offers a Memory Solution for Agere's 2.5G Payload Plus(TM) Network Processor Chip Set

Modular Memory Solution Accelerates Product Time-To-Market

LAKE FOREST, Calif., Jan. 30 /PRNewswire-FirstCall/ -- InterWorks, a Sanmina-SCI Company (Nasdaq: SANM - news), an industry leader in high-end standard and custom memory subsystem solutions, announces the availability of their memory solution for Agere's 2.5G Payload Plus(TM) family of network processing solutions.

With rapidly scaling networking processor performance, more complex high-speed memory is required to perform routing classification, policing, traffic management, QoS/CoS, traffic shaping and packet modification functions. Agere is a market leader with their 2.5G Payload Plus(TM), a breakthrough in OC-48c Network Processor solutions. Traditional memory design approaches for this chipset would require space intensive, high-speed memory subsections or modules for the Routing Switch Processor (RSP), the Fast Pattern Processor (FPP), and the Agere System Interface (ASI). InterWorks' custom memory partitioning solution repositions most of the space consuming memory components from the system board onto a memory daughter card, mounted in parallel to the system board. "This approach eases space constraints, adds flexibility and reduces development time by providing a proven memory solution in a variety of memory densities," said Martin Munzer, Vice President, Product Marketing for InterWorks.

Memory densities for the Fast Pattern Processor (FPP) range from 4MB to 16MB of SRAM for the Program, 4MB to 16MB of SRAM for the Control, and 32MB to 128MB of SDRAM for the Data Buffer section. Densities for the Routing Switch Processor (RSP) range from 4MB to 16MB of SRAM for the Link List, 8MB to 32MB of SRAM for the Scheduler, and 64MB to 256MB of SDRAM for the Data Buffer section. For additional information on the memory subsystem solution, please contact the product marketing team at InterWorks (www.iwcp.com, or, 949-599-0100).

About InterWorks

InterWorks (www.iwcp.com) is an industry leader in modular DSP, Flash, SRAM and DRAM memory subsystem solutions, focusing on Networking, Telecomm, OEM and Industrial markets. Using the latest technologies, including InterWorks' own patented FRAMM and M3 Multi-Memory Module(TM) technologies, InterWorks offers standard and custom designs for every possible requirement. As a subsidiary of Sanmina-SCI, InterWorks combines the flexibility of an engineering company with the resources of a global electronics contract manufacturer.

About Sanmina-SCI

Sanmina-SCI Corporation is a leading electronics contract manufacturer serving the fastest-growing segments of the $130 billion global electronics manufacturing services (EMS) market. Recognized as a technology leader, Sanmina-SCI provides end-to-end manufacturing solutions, delivering unsurpassed quality and support to large OEMs primarily in the communications, industrial and medical instrumentation, and computer technology sectors of the market. Sanmina-SCI has over 100 facilities strategically located in key regions throughout the world.

Safe Harbor Statement

The foregoing, including the discussion regarding the company's future prospects, contains certain forward-looking statements that involve risks and uncertainties, including uncertainties associated with economic conditions in the electronics industry, particularly in the principal industry sectors served by the company, changes in customer requirements and in the volume of sales to principal customers, the ability of Sanmina-SCI to effectively integrate its operations following the merger of Sanmina Corporation and SCI Systems, Inc. and to assimilate other acquired businesses and achieve the anticipated benefits of the merger and other such acquisitions, and competition and technological change. The company's actual results of operations may differ significantly from those contemplated by such forward-looking statements as a result of these and other factors, including factors set forth in the company's 2001 Annual Report on Form 10-K filed with the Securities Exchange Commission on December 21, 2001.

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